This machine is an easy-to-operate desktop single side polishing machine. It can be matched with copper plate, tin plate, glass plate, stainless steel plate, etc., and with different types of polishing slurry, suitable for lapping and polishing various semiconductor materials, and meet the needs of R&D and small batch production of research institutes & enterprises.

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  • Rotation function of polishing head

  • Swing function of polishing head

  • Vacuum squeeze head or weight pressing block

  • Small space occupation

Performance Parameter

Specification / model TSP-380
Polishing plate size 380mm
Ceramic plate size 139mm
Polishing head qty. 2
Polishing plate rotation 0~ 70RPM
Swing range ±5mm

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