POLI-762 is a small 12 inch chemical mechanical polishing machine, which adopts manual loading method, can optionally be equipped with semiautomatic loading pallet, uses membrane airbag to increase pressure flexibly, and can be equipped with friction force & temperature endpoint monitoring system, used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. The applications are wide.

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  • Complete functions

    Put membrane back pressure on the wafer, polishing plate has built-in cooling system. Swing arm dresser, friction & temperature detection endpoint monitoring function and pressurization system on different areas is optional.

  • Simple operation

    PC control system, touch screen control, semiautomatic loading pallet is optional, one-button automatic CMP polishing.

  • Good compatibility

    3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4, 6, 8 & 12 inch polishing head, compatible with different sizes and types wafers.

  • Small floor space

    Minimize the floor space of clean room.

Performance Parameter

Specification / model POLI-762
Wafer size Max 12 inch
Polishing plate size Ø762mm(30inch)
Polishing plate rotation 30~200 RPM
Polishing head rotation 30~200 RPM
Wafer pressure 70~350g/cm2 membrane airbag flexible pressure
Reciprocating dressing system Swing dressing system can be upgraded
Friction & temperature monitoring system Optional, EPD function can add
Semi-automatic loading pallet Optional
Head pressurization on different area Optional
Slurry supply system Peristaltic pump,3 independent pipes

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