Put membrane back pressure on the wafer, polishing plate has built-in cooling system. Swing arm dresser, friction & temperature detection endpoint monitoring function and pressurization system on different areas is optional.
PC control system, touch screen control, semiautomatic loading pallet is optional, one-button automatic CMP polishing.
3 independent slurry supply pipelines, easy-replacing polishing plate, replaceable 4, 6, 8 & 12 inch polishing head, compatible with different sizes and types wafers.
Minimize the floor space of clean room.
Specification / model | POLI-762 |
Wafer size | Max 12 inch |
Polishing plate size | Ø762mm(30inch) |
Polishing plate rotation | 30~200 RPM |
Polishing head rotation | 30~200 RPM |
Wafer pressure | 70~350g/cm2 membrane airbag flexible pressure |
Reciprocating dressing system | Swing dressing system can be upgraded |
Friction & temperature monitoring system | Optional, EPD function can add |
Semi-automatic loading pallet | Optional |
Head pressurization on different area | Optional |
Slurry supply system | Peristaltic pump,3 independent pipes |