Equipped with heating table, pressing plate and water-cooling pipe.
PLC control system, manual waxing and placing, bonding process of pressing and cooling automatically
Compatible with various size of wafers below 150mm in diameter and bonding process of various semiconductor materials
Desktop design, space occupation is small in the clean room.
|Wafer size||Max 6 inch||Max 6 inch|
|Water cooling function||Available||Available|
|Vacuum waxing function||None||Available|