Solid Wax Bonding Machine

This machine is a high-precision desktop wax bonding machine in manual waxing and placing, with heating and cooling function, automatic pressing, uniform wax layer. The vacuum waxing function can be upgraded, vacuuming first, hot pressing and cooling, the waxing effect is better.

Contact us


  • Complete functions

    Equipped with heating table, pressing plate and water-cooling pipe.

  • Simple operation

    PLC control system, manual waxing and placing, bonding process of pressing and cooling automatically

  • Good compatibility

    Compatible with various size of wafers below 150mm in diameter and bonding process of various semiconductor materials

  • Small floor space

    Desktop design, space occupation is small in the clean room.

Performance Parameter

Item TWB-150 TWB-150V
Wafer size Max 6 inch Max 6 inch
Pressing pressure Adjustable Adjustable
Pressing time Adjustable Adjustable
Water cooling function Available Available
Vacuum waxing function None Available
Machine size W560*D450*H850mm W560*D450*H850mm

Welcome to the official account.