This machine is a fully-automatic wafer cleaning machine, automatically operated by a manipulator in a closed environment, has cleaning and drying functions, suitable for cleaning of various semiconductor substrate materials after polishing, and can effectively reduce particle contamination on the wafer surface.
With the function of cleaning and drying, operated by a manipulator in a closed environment, low risk, prevention of secondary pollution.
PLC touch screen control, manipulator automatically completes the automatic wafer cleaning process from cassette to cassette.
Compatible with 2, 4 and 6 inch wafer
Minimize the floor space in the clean room.
| Item | TWB-200 |
| Wafer size | 2、4、6 inch |
| Fully automatic loading and unloading system | Available |
| Loading table | 2 |
| Unoading table | 2 |
| Cleaning station | 2 |
| Wafer fixing | Vacuum absorption |
| Brushing | PVA brush, moving up & down, left & right |
| Drying | High speed spinning |
| Control system | PLC touch screen |
86-10-6477 8430
Add：Building 6, No. 3, Duyang North Street, Shunyi District, Beijing 101300
Email：sales@tsd-semicon.com
Fax：86-10-6477 8420
