Post-CMP Cleaning Machine

These series machines are special cleaning machines after wafer CMP. They have different structures such as single station type, index type, and in-line type, can be used in different applications, the in-line type machine is equipped with fully- automatic loading and unloading system. These series machines are equipped with rinsing, double-side brushing, megasonic cleaning, N2 drying, high-speed spin-drying functions, high integration, small foot space, wet in and dry out, suitable for cleaning all kinds of wafers after CMP.

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Features

  • Complete functions

    These series machines are equipped with rinsing, double-side brushing, megasonic cleaning, N2 drying, high-speed spin-drying functions.

  • Simple operation

    PLC system, touch screen control, one-button automatic brushing and cleaning, the in-line type machine is equipped with fully-automatic loading and unloading system, “cassette to cassette”is more convenient.

  • Good compatibility

    Compatible with 4 to12 inch wafers by changing the fixture

  • Small foot space

    Minimize the foot space in the clean room

Performance Parameter

Specification / model Cleaner 412S Cleaner 412R Cleaner 426L Cleaner 812L
Cleaning station Single chamber single station Index 4 stations In-line type 6 stations In-line type 6 stations
Loading and unloading Manual Manual Manual Fully automatic
Wafer size 4 to 12 inch 4 to 12 inch 4 to 6 inch 8 to 12 inch
Rinsing (pre-cleaning) DIW rinsing DIW rinsing DIW rinsing DIW rinsing
Brushing mechanism 2 PVA brushes, double-side brushing 2 PVA brushes, double-side brushing 2 PVA brushes, double-side brushing 2 PVA brushes, double-side brushing
PVA brush rotation 30- 200rpm 30- 200rpm 30- 300rpm 30- 300rpm
PVA brush gap Adjustable Adjustable Adjustable Adjustable
Megasonic cleaning Optional Optional Optional Optional
N2 blow drying Available Available Available Available
High speed spin-drying Max 2000rpm Max 2500rpm Max 2000rpm Max 2000rpm
Control System PLC PLC PC PC

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