应用领域-北京特思迪半导体设备有限公司

Semiconductor Substrate

Silicon germanium gallium arsenide indium phosphide silicon carbide gallium nitride aluminum nitride gallium oxide gallium antimonide Indium antimonide cadmium zinc tellurium lithium niobate lithium tantalate and diamond

Semiconductor substrate

Power devices RF devices Filters Lasers Optical Communication Devices Detectors Silicon Photonic Devices Mini/Micro LED

Wafer fabrication

Oxides metals STI SOI MEMS

Advanced packaging

TSD can provide TSV, TGV, SIP, WLP, FOPLP, SIP, and other advanced packaging, process wafer thinning, wafer CMP, substrate thinning, substrate CMP equipment, and processing solutions.

TSV TGV SIP CoWoS FOPLP