This series comprises special cleaning equipment for wafers after CMP, with a single-station single-chamber design. These machines can integrate PVA scrubbing, mega-sonic cleaning, N2 blow drying, high-speed spin drying, and other functions with a high degree of integration, and are suitable for cleaning various semiconductor wafers after CMP.
该系列为 CMP 后晶圆提供专用清洗设备，采用单工位单室设计。这些设备可集成 PVA 擦洗、超声波清洗、氮气吹干、高速脱水干燥等高度集成功能，适用于 CMP 后清洗各类半导体晶圆。