Fully-Automatic Grinder/Polisher
TGP-3350
This equipment is suitable for thinning and polishing of 8-12-inch wafers, fully adopting air-float spindles and air-float turntable design. It is equipped with automatic thickness measurement, integrated wafer calibration and other functions, realizing fully automatic loading/unloading and dry-in dry-out operation
Maximum Wafer Size12 inch
Grinding spindle power7.5 kw
Grinding spindle grinding wheel sizeOD303 mm
Polishing head sizeOD450 mm
